LITERATURE / TECHNICAL INFORMATION

Data Center

A better approach to data center cooling

The UFRC (Under Floor Rack Cooler) replaces traditional CRAH units with smaller coolers located under each rack. These are virtually linked together to provide redundancy and dynamic rack and pod level cooling control, all while using less energy. Our patent pending solution eliminates the underfloor plenum with its inherent difficulties managing rack hot spots; the UFRC delivers cold air exactly where and when it is needed. Importantly, the UFRC system is completely scalable to meet unknown future needs allowing more racks per pod, more pods in the data hall, and more kilowatts of cooling per rack.

De-centralized, local air-cooling units
- Located under server racks, and replaces central large air handlers
- Virtually linked together for precise pod level controls and dynamic rapid response
- Physically connected to eliminate under floor plenum pressurization

Responds to varying heat loads dynamically at the pod level
- Cold air exactly where and when it is needed

Patent pending

Integrates with liquid cooling
- Handles all air-cooling needs of high-density racks when combined with direct-to-chip liquid cooling

15% Energy Reduction

Scalable to meet current and unpredictable future requirements

"Another important point is that with direct-to-chip or plate liquid cooling, there is still a requirement for some air cooling, with anywhere from 10% to 25% of the load needing to be handled by air, Brown added." FULL ARTICLE